Nanya Technology to build 3D wafer packaging, testing fab in Pingtung Science Park

Bitget2026/10/01 07:54

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Nanya Technology will build a 3D wafer packaging and testing fab in Pingtung Science Park, following clearance from Taiwan’s NSTC.
Plant will add TSV-based 3D IC capability, targeting wafer stacking for integrated packaging and testing.
Project aims to support high-performance, high-bandwidth memory demand tied to rapid expansion in AI applications.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Nanya Technology Corporation published the original content used to generate this news brief on October 01, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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Nanya Technology to build 3D wafer packaging, testing fab in Pingtung Science Park

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