Qualcomm collaborates with Amazon to develop custom AI data center chips and optical interconnect solutions

Qualcomm (QCOM.US) announced today a multi-generational partnership with Amazon (AMZN.US) to provide customized chips for large-scale AI data centers and jointly advance AI inference. The two parties are also collaborating on the development of optical interconnect solutions with speeds up to 1.6T and for future generations. Qualcomm plans to deepen its use of AWS AI infrastructure (including Amazon Bedrock) for electronic design automation (EDA) workloads, aiming to shorten chip design cycles. Cristiano Amon, President and CEO of Qualcomm, stated that as AI demand accelerates, data center infrastructure requires breakthroughs in both computing and connectivity, and Qualcomm is pleased to collaborate with AWS on customized chips and connectivity solutions. Prasad Kalyanaraman, Vice President of AWS, said that this partnership builds on a strong relationship and is dedicated to jointly providing customers with more efficient and cost-effective infrastructure.