Qualcomm and Amazon Forge Multi-Generational Partnership to Promote Custom AI Data Center Chips

On September 8, Qualcomm (QCOM.O) announced a multi-generational partnership with Amazon (AMZN.O) to provide customized chips for large-scale AI data centers and to jointly advance AI inference. The two companies are also collaborating on the development of optical interconnect solutions with a capacity of up to 1.6T and future generations. Qualcomm plans to deepen its use of AWS AI infrastructure, including Amazon Bedrock, for electronic design automation (EDA) workloads, aiming to shorten chip design cycles. Qualcomm President and CEO Cristiano Amon stated that the accelerating demand for AI necessitates breakthroughs in computing and connectivity for data center infrastructure, and Qualcomm is pleased to collaborate with AWS on customized chips and connectivity solutions. AWS Vice President Prasad Kalyanaraman noted that this partnership is built on a solid foundation of collaboration, committed to providing customers with more efficient and cost-effective infrastructure.