Northrop Grumman Wins $7 Million DARPA Contract for Diamond-Cooled Microchips

11:30 AM EDT, 08/27/2026 (MT Newswires) -- Northrop Grumman (NOC) said Thursday it won a $7 million contract from the US Defense Advanced Research Projects Agency to build microchips cooled with microscopic diamonds for military hardware. The technology embeds diamond layers into semiconductors to pull heat away from radio frequency circuits during high-power tasks, the company said. The company developed the cooling process alongside Stanford University by growing diamond channels on the back of the chips, Northrop Grumman said. Northrop Grumman expects the second phase of the program to triple the power density of the components, it said. Price: 545.82, Change: -4.13, Percent Change: -0.75