LG Chem to showcase advanced packaging materials for AI semiconductors at SEMICON Taiwan 2026

Reuters2026/08/26 10:24

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LG Corp. unit LG Chem will attend SEMICON Taiwan 2026 on Sept. 2-4 in Taipei to showcase AI semiconductor packaging materials.
Exhibit targets advanced packaging for HBM and AI chips, seeking deeper ties with chipmakers, OSATs, substrate, packaging companies.
Power semiconductor materials for AI data centers will also be shown, including sintering pastes and thermal interface materials.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. LG Corp. published the original content used to generate this news brief on August 26, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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LG Chem to showcase advanced packaging materials for AI semiconductors at SEMICON Taiwan 2026

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