Murata to showcase AI power and packaging technologies at Hot Chips conference

Reuters2026/08/10 14:34

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Murata will attend the Hot Chips 2026 conference in Palo Alto, California, on Aug. 23-25.
The company plans to showcase power-delivery, packaging, connectivity technologies targeting next-generation AI infrastructure.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Murata Manufacturing Co. Ltd. published the original content used to generate this news brief on August 10, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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Murata to showcase AI power and packaging technologies at Hot Chips conference

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