The 16th upgrade of the Tezos protocol, Paris, has been launched on the main network
The 16th upgrade of the Tezos protocol, Paris, was launched on the main network on June 5. The key goal of this upgrade and the Tezos scalability roadmap is to maintain low transaction fees on Etherlink, an EVM-compatible L2 network, including in situations where network demand is high.
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The AI arms race extends upstream! Reports say Intel, Nvidia, and AMD are prepaying over 100 billions NTD to secure advanced IC substrate production capacity.
NVIDIA, Intel, and AMD have collectively spent $5 billion in advance payments to aggressively secure high-end IC substrates from Taiwan. Driven by "big money for guaranteed orders," the top three Taiwanese substrate manufacturers have invested a record NT$161.2 billion to expand their production capacity. The tech giants' substantial financial commitments to secure supply chains highlight the intense competition and extreme scarcity of core AI materials.


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